Project Description
Customized 99% Beryllium Oxide Ceramic Metallized Substrates
| Specification | Parameter |
|---|---|
| Size | 1-114 mm |
| Thickness | 0.2-20 mm |
| Color | White |
| Main Material of Metal Layer | Tungsten-Manganese |
| Metal Layer Thickness | 10-30 μm |
| Gold Layer Thickness | 0.8-1.2 μm |
| Tensile Strength of Metal Layer | ≥20 MPa |
| Operating Temperature | -40°C to +900°C |
| Applications | Solid-State Electronics, Various High-Power Devices, Optical Communications |
Application:
Beryllia (BeO) ceramic metallized substrates are advanced materials prized for their exceptional thermal conductivity, electrical insulation, and mechanical strength. These unique properties make them ideal for high-power electronics, aerospace applications, and other demanding environments where efficient heat dissipation and reliable performance are critical.
BeO ceramic metallized substrates are lightweight, highly rigid, and offer superior thermal management capabilities—meaning they can withstand extreme temperatures and dissipate heat more rapidly than any other ceramic material. With a thermal conductivity ten times greater than that of alumina ceramics, beryllia is particularly effective in heat-generating circuits, such as those involving high currents or densely packed components. Additionally, its low dielectric constant enhances electrical performance, especially at higher frequencies, making it a preferred choice for advanced electronic systems.
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